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NTP4302, NTB4302
Power MOSFET
74 Amps, 30 Volts
N?Channel TO?220 & D 2 PAK
Features
http://onsemi.com
?
?
?
?
?
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Low R DS(on)
Higher Efficiency Extending Battery Life
Diode Exhibits High Speed, Soft Recovery
Avalanche Energy Specified
I DSS Specified at Elevated Temperature
Pb?Free Packages are Available
V DSS
30 V
R DS(ON) MAX I D MAX
9.3 m W @ 10 V 74 A
N?Channel
D
Typical Applications
? DC?DC Converters
? Low Voltage Motor Control
? Power Management in Portable and Battery Powered Products:
Ie: Computers, Printers, Cellular and Cordless Telephones, and
PCMCIA Cards
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
4
S
4
Rating
Symbol
Value
Unit
1
2
Drain?to?Source Voltage
V DSS
30
Vdc
TO?220AB
3
D 2 PAK
Drain?to?Gate Voltage (R GS = 10 M W )
Gate?to?Source Voltage ? Continuous
V DGR
V GS
30
" 20
Vdc
Vdc
1
2
3
CASE 221A
STYLE 5
CASE 418AA
STYLE 2
Drain Current
? Continuous @ T C = 25 ° C
? Continuous @ T C = 100 ° C
? Single Pulse (t p v 10 m s)
I D
I D
I DM
74
47
175
Adc
Apk
4
MARKING DIAGRAMS
& PIN ASSIGNMENTS
Total Power Dissipation @ T C = 25 ° C
Derate above 25 ° C
Operating and Storage Temperature Range
P D
T J , T stg
80
0.66
?55 to
W
W/ ° C
° C
Drain
4
Drain
+150
Single Pulse Drain?to?Source Avalanche
Energy ? Starting T J = 25 ° C
E AS
722
mJ
NTx4302G
AYWW
NTx4302G
AYWW
(V DD = 30 Vdc, V GS = 10 Vdc, L = 5.0 mH
I L(pk) = 17 A, V DS = 30 Vdc, R G = 25 W )
Thermal Resistance
? Junction?to?Case
? Junction?to?Ambient (Note 1)
R q JC
R q JA
1.55
70
° C/W
1
Gate
2
Drain
3
Source
1
Gate
2
Drain
3
Source
Maximum Lead Temperature for Soldering
T L
260
° C
NTx4302
= Device Code
Purposes, 1/8 in from case for 10 seconds
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
x
A
Y
WW
G
= B or P
= Assembly Location
= Year
= Work Week
= Pb?Free Package
1. When surface mounted to an FR4 Board using minimum recommended Pad
Size, (Cu Area 0.412 in 2 ).
2. Current limited by internal lead wires.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
? Semiconductor Components Industries, LLC, 2005
August, 2005 ? Rev. 3
1
Publication Order Number:
NTP4302/D
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